ELECTRONICS

LAI offers close-tolerance, high-speed cutting and slitting of thin materials, including circuit boards, films and foils. LAI’s high-speed CO₂ laser cutting services handle plastics, thermal-bond adhesives, polymers, ceramics, Kapton polyimide film and other thin materials. In addition, precision waterjet cutting provides processing alternatives for cutting requiring no heat input and maximum utilization of material.

• IS0 9001:2000 certified contract manufacturer
• Production and prototype development
• Engineering staff can design work approach offering real choices to process printed circuit board or other electronics-related applications

Thin material processing services include:

• Cutting of slots, holes, patterns and small features with tight tolerances.
• Vision system coordinate inspection.
• Multi-head processing and in-house tooling available.